CENELEC - EN 62047-17
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 July 2015 |
| Status: | active |
| Page Count: | 34 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
scope:
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μm to 10 μm, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm.
The tests are carried out at ambient temperature, by applying a
uniformly-distribute
Elastic modulus and residual stress for the film materials can be determined with this method.
Document History
EN 62047-17
July 1, 2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials,...