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JEDEC JESD 22-A101

Steady-State Temperature-Humidity Bias Life Test

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Organization: JEDEC
Publication Date: 1 July 2015
Status: active
Page Count: 12
scope:

The Steady-State Temperature-Humidity Bias Life Test is performed to evaluate the reliability of nonhermetic packaged IC devices in humid environments. Temperature, humidity, and bias conditions are applied to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it.

Document History

JEDEC JESD 22-A101
July 1, 2015
Steady-State Temperature-Humidity Bias Life Test
The Steady-State Temperature-Humidity Bias Life Test is performed to evaluate the reliability of nonhermetic packaged IC devices in humid environments. Temperature, humidity, and bias conditions are...
March 1, 2009
Steady State Temperature Humidity Bias Life Test
This standard establishes a defined method and conditions for performing a temperature humidity life test with bias applied. The test is used to evaluate the reliability of non-hermetic packaged...
April 1, 1997
Steady-State Temperature Humidity Bias Life Test
A description is not available for this item.
July 1, 1988
Steady-State Temperature Humidity Bias Life Test (Revision of Test Method A101 - Previously Published in JESD22-B)
A description is not available for this item.

References

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