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IPC/JEDEC-9702

Monotonic Bend Characterization of Board-Level Interconnects

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Organization: IPC
Publication Date: 1 May 2015
Status: active
Page Count: 3

Document History

IPC/JEDEC-9702
May 1, 2015
Monotonic Bend Characterization of Board-Level Interconnects
A description is not available for this item.
June 1, 2004
Monotonic Bend Characterization of Board-Level Interconnects
This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations....
June 1, 2004
Monotonic Bend Characterization of Board-Level Interconnects
This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations....
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