IPC/JEDEC-9702
Monotonic Bend Characterization of Board-Level Interconnects
inactive
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| Organization: | IPC |
| Publication Date: | 1 June 2004 |
| Status: | inactive |
| Page Count: | 28 |
scope:
This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/ fail requirements are typically specific to each device application and are outside the scope of this document.
Document History
May 1, 2015
Monotonic Bend Characterization of Board-Level Interconnects
A description is not available for this item.
June 1, 2004
Monotonic Bend Characterization of Board-Level Interconnects
This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations....
IPC/JEDEC-9702
June 1, 2004
Monotonic Bend Characterization of Board-Level Interconnects
This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations....