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IPC-4821

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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Organization: IPC
Publication Date: 1 April 2010
Status: active
Page Count: 10

Document History

IPC-4821
April 1, 2010
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
A description is not available for this item.
IPC-4821
May 1, 2006
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive...

References

This document references:
IEC 61000-4-2 - Electromagnetic compatibility (EMC) – Part 4-2: Testing and measurement techniques – Electrostatic discharge immunity test
Published by IEC on December 1, 2008
This International Standard relates to the immunity requirements and test methods for electrical and electronic equipment subjected to static electricity discharges, from operators directly, and to...
This document references:
IPC-QL-653 - Certification of Facilities That Inspect/Test Printed Boards, Components and Materials
Published by IPC on November 1, 1997
This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document is referenced by:
IPC-6012 REDLINE - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on September 1, 2015
Statement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Purpose The purpose of this specification is...
This document is referenced by:
IPC-6018 - Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Published by IPC on July 1, 2016
Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline...
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