DIN EN ISO 9453
Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)
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| Organization: | DIN |
| Publication Date: | 1 December 2006 |
| Status: | inactive |
| Page Count: | 16 |
| ICS Code (Brazing and soldering): | 25.160.50 |
scope:
This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys:
- tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
- tin-antimony;
- tin-bismuth;
- tin-copper, with and without silver;
- tin-indium, with and without silver and bismuth;
- tin-silver, with and without copper and bismuth;
- tin-zinc, with and without bismuth.
It also includes an indication of the forms generally available.
Document History
January 1, 2021
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
A description is not available for this item.
October 1, 2019
Soft solder alloys - Chemical compositions and forms (ISO/DIS 9453:2019); German and English version prEN ISO 9453:2019
A description is not available for this item.
December 1, 2014
Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
WARNING — National or regional regulations may limit the employment of certain alloys.
This International Standard specifies the requirements for chemical composition for soft solder alloys...
DIN EN ISO 9453
December 1, 2006
Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)
This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys:
- tin-lead, with and without antimony, bismuth, cadmium, copper, and...