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CEI EN 61189-5-3

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

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Organization: CEI
Publication Date: 1 May 2016
Status: active
Page Count: 48
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

Document History

CEI EN 61189-5-3
May 1, 2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...

References

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