IEC 61190-1-1
Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
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| Organization: | IEC |
| Publication Date: | 1 March 2002 |
| Status: | active |
| Page Count: | 50 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
IEC 61190-1-1
March 1, 2002
Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
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