DIN EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
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| Organization: | DIN |
| Publication Date: | 1 December 2016 |
| Status: | active |
| Page Count: | 13 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Dieser Teil von IEC 61189 legt ein Prüfverfahren zur Überwachung des Widerstands von Einzeldurchkontaktie
Document History
DIN EN 61189-3-719
December 1, 2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
Dieser Teil von IEC 61189 legt ein Prüfverfahren zur Überwachung des Widerstands von Einzeldurchkontaktierungen (PTHs) (en: plated through holes) in Leiterplatten fest, um die Langzeitzuverlässigkeit...
April 1, 2014
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling (IEC 91/1152/CD:2013)
Zweck
Der Zweck dieser Prüfung ist es, den Widerstand von Einzeldurchkontaktierungen (PTHs) in Leiterplatten zu überwachen, um die Langzeitzuverlässigkeit der PTHs unter thermomechanischen...