BSI - BS EN 62047-25
Semiconductor devices — Micro-electromechanical devices Part 25: Silicon based MEMS fabrication technology — Measurement method of pull-press and shearing strength of micro bonding area
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| Organization: | BSI |
| Publication Date: | 30 November 2016 |
| Status: | active |
| Page Count: | 28 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
BS EN 62047-25
November 30, 2016
Semiconductor devices — Micro-electromechanical devices Part 25: Silicon based MEMS fabrication technology — Measurement method of pull-press and shearing strength of micro bonding area
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