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AIA/NAS - NAS4123

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

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Organization: AIA/NAS
Publication Date: 30 March 2012
Status: active
Page Count: 16

Document History

NAS4123
March 30, 2012
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
A description is not available for this item.
March 30, 2012
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
A description is not available for this item.
January 1, 1995
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
A description is not available for this item.

References

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