AIA/NAS - NAS4123
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
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Organization: | AIA/NAS |
Publication Date: | 30 March 2012 |
Status: | active |
Page Count: | 16 |
Document History

NAS4123
March 30, 2012
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
A description is not available for this item.

March 30, 2012
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
A description is not available for this item.

January 1, 1995
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
A description is not available for this item.