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AIA/NAS - NAS4123

Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)

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Organization: AIA/NAS
Publication Date: 1 January 1995
Status: inactive
Page Count: 16

Document History

NAS4123
January 31, 2024
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
A description is not available for this item.
NAS4123
March 30, 2012
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
A description is not available for this item.
NAS4123
March 30, 2012
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
A description is not available for this item.
NAS4123
January 1, 1995
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
A description is not available for this item.

References

This document references:
MIL-PRF-8625 - ANODIC COATINGS FOR ALUMINUM AND ALUMINUM ALLOY
Published by NPFC on November 23, 2020
Scope. This specification covers the requirements for six types and two classes of electrolytically formed anodic coatings on aluminum and aluminum alloys for non-architectural applications (see 6.1).
This document references:
MIL-DTL-5541 - CHEMICAL CONVERSION COATINGS ON ALUMINUM AND ALUMINUM ALLOYS
Published by NPFC on July 11, 2006
This specification covers chemical conversion coatings formed by the reaction of chemical conversion materials with the surfaces of aluminum and aluminum alloys.
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