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JSA - JIS C 61760-4

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

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Organization: JSA
Publication Date: 20 December 2016
Status: active
ICS Code (Electronic component assemblies): 31.190

Document History

JIS C 61760-4 AMD 1
October 20, 2021
Surface mounting technology -- Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Amendment 1)
A description is not available for this item.
JIS C 61760-4
December 20, 2016
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
A description is not available for this item.

References

This document references:
IEC 60749-20 - Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by IEC on August 1, 2020
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This document references:
JIS C 5070 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Published by JSA on December 21, 2009
Scope and object This Standard describes the transportation and storage conditions for surface mounting devices (hereafter referred to as "SMDs") that are fulfilled and used in order to enable...
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