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DLA - DSCC-VID-V62/06665

MICROCIRCUIT, DIGITAL, DUAL RETRIGGERABLE MONOSTABLE MULTIVIBRATOR, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 2 May 2007
Status: inactive
Page Count: 11
scope:

This drawing documents the general requirements of a high performance dual retriggerable monostable multivibrator microcircuit, with an operating temperature range of -55°C to +125°C.

Document History

DSCC-VID-V62/06665 REV B
November 12, 2021
MICROCIRCUIT, DIGITAL, DUAL RETRIGGERABLE MONOSTABLE MULTIVIBRATOR, MONOLITHIC SILICON
Scope. This drawing documents the general requirements of a high performance dual retriggerable mono stable multi vibrator microcircuit, with an operating temperature range of -55°C to +125°C.
DSCC-VID-V62/06665 REV A
June 24, 2014
MICROCIRCUIT, DIGITAL, DUAL RETRIGGERABLE MONOSTABLE MULTIVIBRATOR, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance dual retriggerable mono stable multi vibrator microcircuit, with an operating temperature range of -55°C to +125°C.
DSCC-VID-V62/06665
May 2, 2007
MICROCIRCUIT, DIGITAL, DUAL RETRIGGERABLE MONOSTABLE MULTIVIBRATOR, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance dual retriggerable monostable multivibrator microcircuit, with an operating temperature range of -55°C to +125°C.

References

This document references:
JEP95 BOOK 1 - Book One Registered and Standard Outlines for Solid State and Related Products
Published by JEDEC on March 1, 1997
PREFACE This Publication contains those solid state product outlines and other associated drawings that have been registered and assigned a JEDEC designation and are printed on white paper. Product...
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
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