Standard: IEC 60068-2-69
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
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This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
|Organization:||International Electrotechnical Commission|
|Document Number:||iec 60068-2-69|
|Change Type:||COMPLETE REVISION|
|Most Recent Revision:||NO|
|Document #||Change Type||Update Date||Revision||Status|
|IEC 60068-2-69||Change Type: COR1||Revision: 3.0||Status: ACTV|
|IEC 60068-2-69||Change Type: COR1||Update Date: 2018-01-01||Revision: 3.0||Status: ACTV|
|IEC 60068-2-69||Change Type: STCH||Update Date: 2007-05-01||Revision: 2.0||Status: INAC|
|IEC 60068-2-69||Change Type:||Update Date: 1995-12-01||Revision: 1.0||Status: INAC|
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