IEC 60068-2-69
Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
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| Organization: | IEC |
| Publication Date: | 1 May 2007 |
| Status: | inactive |
| Page Count: | 28 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Environmental testing): | 19.040 |
scope:
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.
This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Document History
June 1, 2019
Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
June 1, 2019
Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method AMENDMENT 1
A description is not available for this item.
January 1, 2018
ENVIRONMENTAL TESTING – Part 1: 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)
A description is not available for this item.
March 1, 2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
IEC 60068-2-69
May 1, 2007
Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively...
December 1, 1995
Environmental Testing - Part 2: Tests - Test Te: Solderability Testing of Electronic Components for Surface Mount Technology by the Wetting Balance Method
A description is not available for this item.