scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA Levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 OMA2541SKB, MSK 2541B High power, dual operational amplifier 02 OMA2541SKCB High power, dual operational amplifier

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H or K Certification and Qualification to MIL-H-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 8 Flange mount Y See figure 1 12 Dual-in-line (power)

The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (±V_CC) . . . . . . . . . . . . . . . . . ±40 V dc Differential input voltage . . . . . . . . . . . . . . . ±V_CC Common mode input voltage . . . . . . . . . . . . . . . ±V_CC Maximum power dissipation (P_D) 2/ 3/ . . . . . . . . . . 125 W Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Thermal resistance, junction-to-case (θ_JC): Device type 01 . . . . . . . . . . . . . . . . . . . . 2.2°C/W Device type 02 . . . . . . . . . . . . . . . . . . . . 1.5°C/W Junction temperature (T_J) . . . . . . . . . . . . . . . +200°C

Supply voltage (±V_CC) . . . . . . . . . . . . . . . . . ±34 V dc Ambient operating temperature range (T_A) . . . . . . . . −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.