DSF/PREN 60749-12
Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
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| Organization: | DS |
| Status: | inactive |
| Page Count: | 9 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applicable to cavity-type packages. NOTE - This test method describes a swept sine test. A random vibration test is described in JEDEC document JESD 22-B103
Document History
December 23, 2003
Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It...
August 26, 2002
Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It...
DSF/PREN 60749-12
Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It...