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IPC - J-STD-001 CHINESE

Requirements for Soldered Electrical and Electronic Assemblies

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Organization: IPC
Publication Date: 1 July 2014
Status: inactive
Page Count: 84

Document History

J-STD-001HA CHINESE
October 1, 2021
Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
A description is not available for this item.
J-STD-001HS CHINESE
April 1, 2021
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001H CHINESE
September 1, 2020
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001 CHINESE
February 1, 2020
Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
A description is not available for this item.
J-STD-001 CHINESE
October 1, 2017
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001 CHINESE
July 1, 2015
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001 CHINESE
July 1, 2014
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001 CHINESE
July 1, 2014
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001 CHINESE
April 1, 2010
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
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References

This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation. This document presents...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC-TM-650 2.3.25 - Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (ROSE)
Published by IPC on November 1, 2012
1 Scope 1.1 Purpose These tests are used as process control tools; they can be used to inspect printed boards or printed board assemblies and determine if they conform to the monitoring level of the...
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
IPC-TM-650 2.4.22 - Bow and Twist (Percentage)
Published by IPC on June 1, 1999
This test method covers three procedures used to determine the bow and twist percentage of individual rigid printed boards, rigid portions of rigid-flex printed boards, and/or multiple printed...
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
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