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NPFC - MIL-STD-202-218

TEST METHOD STANDARD METHOD 218, BOARD FLEX

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Organization: NPFC
Publication Date: 11 September 2017
Status: inactive
Page Count: 6
scope:

Purpose. This test is performed for verifying that the chip specimens can withstand bending loads that are likely to be applied during normal assembly or handling operations

Document History

September 19, 2018
TEST METHOD STANDARD METHOD 218, BOARD FLEX
Purpose. This test is performed for verifying that the chip specimens can withstand bending loads that are likely to be applied during normal assembly or handling operations. This test is written for...
MIL-STD-202-218
September 11, 2017
TEST METHOD STANDARD METHOD 218, BOARD FLEX
Purpose. This test is performed for verifying that the chip specimens can withstand bending loads that are likely to be applied during normal assembly or handling operations

References

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