NPFC - MIL-STD-202-218
TEST METHOD STANDARD METHOD 218, BOARD FLEX
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| Organization: | NPFC |
| Publication Date: | 19 September 2018 |
| Status: | active |
| Page Count: | 7 |
scope:
Purpose. This test is performed for verifying that the chip specimens can withstand bending loads that are likely to be applied during normal assembly or handling operations. This test is written for typical 2 terminal devices, mounting for other terminal configurations shall be specified in the individual specification.
Document History
MIL-STD-202-218
September 19, 2018
TEST METHOD STANDARD METHOD 218, BOARD FLEX
Purpose. This test is performed for verifying that the chip specimens can withstand bending loads that are likely to be applied during normal assembly or handling operations. This test is written for...
September 11, 2017
TEST METHOD STANDARD METHOD 218, BOARD FLEX
Purpose. This test is performed for verifying that the chip specimens can withstand bending loads that are likely to be applied during normal assembly or handling operations