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BSI - BS EN 61191-2

Printed Board Assemblies Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies

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Organization: BSI
Publication Date: 31 October 2017
Status: inactive
Page Count: 40
ICS Code (Electronic component assemblies): 31.190
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN 61191-2
October 31, 2017
Printed Board Assemblies Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies
A description is not available for this item.
BS EN 61191-2
October 31, 2017
Printed Board Assemblies Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies
A description is not available for this item.
BS EN 61191-2
October 31, 2013
Printed Board Assemblies Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies
A description is not available for this item.
BS EN 61191-2
January 15, 1999
Printed Board Assemblies - Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies
Applies to assemblies that are totally surface mounted or to the surface mounted portions of assemblies that include other related technologies.

References

This document references:
EN ISO 9001 - Quality management systems - Requirements
Published by CEN on September 1, 2015
This International Standard specifies requirements for a quality management system when an organization: a) needs to demonstrate its ability to consistently provide products and services that meet...
This document references:
EN IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by CENELEC on May 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068‑2‑58. This...
This document references:
EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CENELEC on May 1, 2015
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
EN 60194 - Printed board design, manufacture and assembly - Terms and definitions
Published by CENELEC on July 1, 2006
A description is not available for this item.
This document references:
EN 61188-5-1 - Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Published by CENELEC on October 1, 2002
A description is not available for this item.
This document references:
EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CENELEC on May 1, 2015
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
EN ISO 9001 - Quality management systems - Requirements
Published by CEN on September 1, 2015
This International Standard specifies requirements for a quality management system when an organization: a) needs to demonstrate its ability to consistently provide products and services that meet...
This document references:
EN 60194 - Printed board design, manufacture and assembly - Terms and definitions
Published by CENELEC on July 1, 2006
A description is not available for this item.
This document is referenced by:
BS EN IEC 60068-2-21 - Environmental testing Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Published by BSI on September 30, 2021
A description is not available for this item.
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