IEC 60749-12
Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
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| Organization: | IEC |
| Publication Date: | 1 December 2017 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applicable to cavity-type packages.
NOTE This test method describes a swept sine test. A random vibration test is described in JEDEC document JESD 22-B103.
Document History
IEC 60749-12
December 1, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It...
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 12: Vibration, variable frequency CORRIGENDUM 1
A description is not available for this item.
April 1, 2002
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 12: Vibration, Variable Frequency
A description is not available for this item.