scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 55563A Electroluminescent row drivers 02 55564A Electroluminescent row drivers

The devise class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X C-J4 (44-terminal, .662" × .662" × .135"), J-leaded chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range(V_CC1)1/ - - - - - - - - - - - - −0.5 V dc to +15.0 V dc Supply voltage range(V_CC2) - - - - - - - - - - - - - −0.5 V dc to +230 V dc Supply voltage range(V_CC3) - - - - - - - - - - - - - −0.5 V dc to +230 V dc Supply voltage (V_SS) - - - - - - - - - - - - - - - - −230 V dc DC input voltage - - - - - - - - - - - - - - - - - - −0.3 V dc to V_CC1 + 0.3 V dc Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) 2/ - - - - - - - - - 1825 mW Lead temperature (soldering, 10 seconds) - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC) - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - - +175°C

Supply voltage range (V_CC1) - - - - - - - - - - - - +10.8 V dc minimum to +13.2 V dc maximum Supply voltage range (V_CC2) - - - - - - - - - - - - V_CC3 − 15 V dc minimum to V_CC3 maximum Supply voltage range (V_CC3) - - - - - - - - - - - - 0.0 V dc minimum to +225 V dc maximum Supply voltage range (V_SS) - - - - - - - - - - - - 0.0 V dc minimum to −225 V dc maximum Minimum high-level input voltage (V_IH) - - - - - - - 0.75 V_CC1 minimum to V_CC1 +0.3 V dc Maximum low-level input voltage (V_IL) - - - - - - - −0.3 V dc minimum to +0.25 V_CC1 Maximum high-level output current (I_OH) - - - - - - −90 mA Maximum low-level output current (I_OL) - - - - - - - 150 mA Maximum output clamp current (I_OK) - - - - - - - - - ±150 mA Ambient operating temperature range (T_A) - - - - - - −55°C to +125°C Pulse duration (t_W): CLK high - - - - - - - - - - - - - - - - - - - - 125 ns minimum CLK low - - - - - - - - - - - - - - - - - - - - - 125 ns minimum Setup time (t_S1) DATA IN high or low before CLK going low - - - - - - - - - - - - - - - - - - - - 100 ns minimum Setup time (t_S2) CLK low before V_CC2 going high or V_SS going low 3/ - - - - - - - - - - - - - - - - 300 ns minimum Setup time (t_S3) ENABLE high before V_CC2 going high or V_SS going low 3/ - - - - - - - - - - - - - - 300 ns minimum Setup time (t_S4) POS WRITE high or low before V_CC2 going high or V_SS going low 3/ - - - - - - - 300 ns minimum Hold time (t_H1) DATA IN high or low after CLK going low - - - - - - - - - - - - - - - - - - - - 100 ns minimum Hold time (t_H2) CLK high after V_CC2 going low or V_SS going high 3/ - - - - - - - - - - - - - - - - 300 ns minimum Hold time (t_H3) ENABLE high after V_CC2 going low or V_SS going high 3/ - - - - - - - - - - - - - - 0 ns minimum Hold time (t_H4) POS WRITE high or low after V_CC2 going low or V_SS going high 3/ - - - - - - - - - 0 ns minimum Hold time (t_H5) ENABLE low between successive V_CC2 going high 3/ - - - - - - - - - - - - - - - 12 ns minimum Hold time (t_H6) ENABLE low between successive V_SS going low 3/ - - - - - - - - - - - - - - - 300 ns minimum

intended Use: