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DIN EN 60749-3

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017

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Organization: DIN
Publication Date: 1 January 2018
Status: active
Page Count: 14
ICS Code (Semiconductor devices in general): 31.080.01
scope:

Zweck dieses Teils der IEC 60749 ist der Nachweis, dass die Werkstoffe, die konstruktive Gestaltung, der Aufbau, die Kennzeichnung und die Verarbeitung eines Halbleiterbauelements der anzuwendenden Detailspezifikation entsprechen. Die äußere Sichtprüfung ist ein zerstörungsfreies Prüfverfahren und bei allen Bauformen anwendbar. Das Prüfverfahren ist für die Bauelementequalifikation, die Prozesslenkung bzw. Losannahmeprüfung oder beide nützlich.

Document History

DIN EN 60749-3
January 1, 2018
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017
Zweck dieses Teils der IEC 60749 ist der Nachweis, dass die Werkstoffe, die konstruktive Gestaltung, der Aufbau, die Kennzeichnung und die Verarbeitung eines Halbleiterbauelements der anzuwendenden...
DIN EN 60749-3
May 1, 2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 47/2345/FDIS:2016); German version FprEN 60749-3:2016
A description is not available for this item.
DIN EN 60749-3
April 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002
A description is not available for this item.

References

This document references:
DIN EN 60749-9 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017); German version EN 60749-9:2017
Published by DIN on November 1, 2017
Zweck dieses Teils der IEC 60749 ist es, zu bestimmen, ob die Kennzeichnungen auf festen Halbleiterbauelementen lesbar bleiben, wenn darauf Etiketten geklebt und wieder entfernt werden oder die...
This document references:
IEC 60749-9 - Semiconductor devices – Mechanical and climatic test methods – Part 9: Permanence of marking
Published by IEC on March 1, 2017
The purpose of this part of IEC 60749 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of...
This document references:
IEC 61340-5-1 - Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements
Published by IEC on May 1, 2016
This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts,...
This document references:
IEC 62483 - Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
Published by IEC on September 1, 2013
This International Standard describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices....
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