DSF/FPREN 61189-5-503
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 5-503: General test method for materials and assemblies – Conductive anodic filaments (CAF) testing of circuit boards
pending
| Organization: | DS |
| Status: | pending |
| Page Count: | 25 |
scope:
This international standard specifies the conductive anodic filament (hereafter called as CAF) and specifies not only steady state temperature and humidity test but temperature-humidity
Document History
August 14, 2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 5-503: General test method for materials and assemblies – Conductive anodic filaments (CAF) testing of circuit boards
IEC 61189-5-503:2017(E) specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity...
DSF/FPREN 61189-5-503
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 5-503: General test method for materials and assemblies – Conductive anodic filaments (CAF) testing of circuit boards
This international standard specifies the conductive anodic filament (hereafter called as CAF) and specifies not only steady state temperature and humidity test but temperature-humidity cyclic test,...