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JEDEC JESD 22-A122

Power Cycling

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Organization: JEDEC
Publication Date: 1 August 2007
Status: inactive
Page Count: 18
scope:

This Test Method establishes a uniform method for performing component package power cycling stress test. This specification covers power induced temperature cycling of a packaged component, simulating the non-uniform temperature distribution resulting from a device powering on and off in the application.

Document History

JESD22-A122B
November 1, 2023
Power Cycling
This Test Method establishes a uniform method for performing solid state device package power cycling stress test. This specification covers power induced temperature cycling of a packaged component,...
JEDEC JESD 22-A122
June 1, 2016
Power Cycling
This Test Method establishes a uniform method for performing solid state device package power cycling stress test. This specification covers power induced temperature cycling of a packaged component,...
JEDEC JESD 22-A122
August 1, 2007
Power Cycling
This Test Method establishes a uniform method for performing component package power cycling stress test. This specification covers power induced temperature cycling of a packaged component,...

References

This document is referenced by:
IEC 61760-4 - Surface mounting technology – Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Published by IEC on May 1, 2015
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling....
This document is referenced by:
EN 61760-4 - Surface mounting technology – Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Published by CENELEC on July 1, 2015
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling....
This document is referenced by:
DIN EN 61760-4 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015 + A1:2018); German version EN 61760-4:2015 + A1:2018
Published by DIN on September 1, 2018
Dieser Teil von IEC 61760 legt die Klassifikation feuchteempfindlicher Bauteile in mit der Lötwärme verbundene Feuchteempfindlichkeitsklassen sowie Bestimmungen für Verpackung, Kennzeichnung und...
This document is referenced by:
CEI EN 61760-4 - Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Published by CEI on August 1, 2018
INTRODUCTION It is important to note that moisture sensitivity levels existing in both J-STD 020 and IEC 61760-4 are equivalent.
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