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CENELEC - EN 61760-4

Surface mounting technology – Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

active, Most Current
Organization: CENELEC
Publication Date: 1 July 2015
Status: active
Page Count: 38
ICS Code (Electronic component assemblies): 31.190
scope:

This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling.

This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging.

This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to

• semiconductor devices,

• devices for flow (wave) soldering.

NOTE Background of this standard and its relation to currently existing standards, e.g. IEC 60749-20 or J-STD-020 and J-STD-033, are described in the INTRODUCTION.

Document History

EN 61760-4
July 1, 2015
Surface mounting technology – Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling....
July 1, 2015
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling....

References

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