TSE - TS EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
active, Most Current
| Organization: | TSE |
| Publication Date: | 30 October 2014 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
TS EN 61190-1-2
October 30, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
April 29, 2008
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
A description is not available for this item.
April 26, 2004
Attachment materials for electronic assembly ?Part 1-2:Requirements for solder pastes for high-quality interconnections in electronics assembly
Bu standard, elektronik montajlarda yuksek kaliteli elektronikara baglantilari yapmak icin kullanilan lehim macunlarininsiniflandirilmasi ve deneye tabi tutulmasina iliskin genelozellikleri kapsar....
November 11, 2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (IEC 61190-1-2:2002) / Note: Endorsement notice
Bu standard, pvc malzemeden ekstrüde edilmiş, ısıyla büzülemeyen üç tip manşon ile ilgili kuralları kapsar.