TSE - TS EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (IEC 61190-1-2:2002) / Note: Endorsement notice
inactive
| Organization: | TSE |
| Publication Date: | 11 November 2002 |
| Status: | inactive |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
Bu standard, pvc malzemeden ekstrüde edilmiş, ısıyla büzülemeyen üç tip manşon ile ilgili kuralları kapsar.
Document History
October 30, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
April 29, 2008
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
A description is not available for this item.
April 26, 2004
Attachment materials for electronic assembly ?Part 1-2:Requirements for solder pastes for high-quality interconnections in electronics assembly
Bu standard, elektronik montajlarda yuksek kaliteli elektronikara baglantilari yapmak icin kullanilan lehim macunlarininsiniflandirilmasi ve deneye tabi tutulmasina iliskin genelozellikleri kapsar....
TS EN 61190-1-2
November 11, 2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (IEC 61190-1-2:2002) / Note: Endorsement notice
Bu standard, pvc malzemeden ekstrüde edilmiş, ısıyla büzülemeyen üç tip manşon ile ilgili kuralları kapsar.