TSE - TS EN 61189-2
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006) / Note: Endorsement notice
active, Most Current
| Organization: | TSE |
| Publication Date: | 27 March 2007 |
| Status: | active |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
TS EN 61189-2
March 27, 2007
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006) / Note: Endorsement notice
A description is not available for this item.
April 25, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Bu standard, öngerme çeliklerine (çubuk, tel veya halat). uygulanacak deney metotlarını kapsar
November 4, 1997
Test methods for electrical materials, interconnection structures and assemblies-Part 2:Test methods for materials for interconnection structures
A description is not available for this item.