TSE - TS EN 61189-2
Test methods for electrical materials, interconnection structures and assemblies-Part 2:Test methods for materials for interconnection structures
inactive
| Organization: | TSE |
| Publication Date: | 4 November 1997 |
| Status: | inactive |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
March 27, 2007
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006) / Note: Endorsement notice
A description is not available for this item.
April 25, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Bu standard, öngerme çeliklerine (çubuk, tel veya halat). uygulanacak deney metotlarını kapsar
TS EN 61189-2
November 4, 1997
Test methods for electrical materials, interconnection structures and assemblies-Part 2:Test methods for materials for interconnection structures
A description is not available for this item.