TSE - TS EN 60749-14
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
active, Most Current
| Organization: | TSE |
| Publication Date: | 29 April 2008 |
| Status: | active |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Bu standard, elemanin yeniden takilmasi icin yapilan isimuteakip arizali kart duzenegi nedeniyle bacagin/bacaklarinbu
Document History
TS EN 60749-14
April 29, 2008
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Bu standard, elemanin yeniden takilmasi icin yapilan isimuteakip arizali kart duzenegi nedeniyle bacagin/bacaklarinbukulmesi durumunda bacak/paket arayuzu ile bacagin kendisiarasindaki butunlugu...
December 2, 2004
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003) / Note: Endorsement notice
Bu standard, her biri 10 J’u aşmayan kinetik enerjili, metal olmayan sicim kesme elemanlı veya mil üzerinde serbestçe dönen metal olmayan kesicili, şebeke gerilimiyle çalışan, ayakta duran bir...