IPC-TM-650 2.5.6.1
Solder Mask - Dielectric Strength
active, Most Current
Buy Now
| Organization: | IPC |
| Publication Date: | 1 March 2007 |
| Status: | active |
| Page Count: | 1 |
scope:
The dielectric strength test (also called highpotential [Hi-Pot], over potential, or voltage breakdown) consists of the application of a test voltage for a specific time between mutually insulated portions of a printed board or between insulated portions and ground. This is used to prove that the printed board can operate safely at its rated voltage and withstand momentary overpotentials due to switching, surges, and other similar phenomena.
Document History
IPC-TM-650 2.5.6.1
March 1, 2007
Solder Mask - Dielectric Strength
The dielectric strength test (also called highpotential [Hi-Pot], over potential, or voltage breakdown) consists of the application of a test voltage for a specific time between mutually insulated...
February 1, 1988
Dielectric Strength, Polymer Solder Mask, and/or Conformal Coatings
A description is not available for this item.