CEI EN 61191-3
Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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| Organization: | CEI |
| Publication Date: | 1 January 2018 |
| Status: | active |
| Page Count: | 30 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Document History
CEI EN 61191-3
January 1, 2018
Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT...
March 1, 2005
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
La presente Norma fa parte della serie EN 61191.
Essa definisce le prescrizioni relative alle connessioni effettuate utilizzando tecniche di saldatura a fori passanti.
I requisiti riguardano assiemi...
October 1, 2001
Assemblaggio di circuiti stampati - Parte 3: Specifica settoriale - Assemblaggio per saldatura attraverso fori passanti
La presente Norma fornisce prescrizioni per gli assiemi di componenti saldati con fori passanti. Le prescrizioni si riferiscono a quegli assiemi costituiti da componenti a fori passanti (THT) o da...