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IPC/ECA J-STD-002 CHINESE

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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Organization: IPC
Publication Date: 1 June 2013
Status: inactive
Page Count: 68

Document History

IPC/ECA J-STD-002 CHINESE
November 1, 2017
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
A description is not available for this item.
IPC/ECA J-STD-002 CHINESE
June 1, 2013
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
A description is not available for this item.
IPC/ECA J-STD-002 CHINESE
December 1, 2007
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
A description is not available for this item.

References

This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
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