NEN-EN-IEC 61189-3/C1
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
inactive
| Organization: | NEN |
| Publication Date: | 1 November 1997 |
| Status: | inactive |
| Page Count: | 1 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
January 1, 2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed...
October 1, 1999
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
A description is not available for this item.
NEN-EN-IEC 61189-3/C1
November 1, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
A description is not available for this item.
August 1, 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
This part is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and...