NEN-EN-IEC 61189-3
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 January 2008 |
| Status: | active |
| Page Count: | 130 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
Document History
NEN-EN-IEC 61189-3
January 1, 2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed...
October 1, 1999
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
A description is not available for this item.
November 1, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
A description is not available for this item.
August 1, 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
This part is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and...