NEN-EN-IEC 60068-2-58
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
inactive
| Organization: | NEN |
| Publication Date: | 1 May 1999 |
| Status: | inactive |
| Page Count: | 30 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Environmental testing): | 19.040 |
scope:
Provides procedures for determining tot solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD).
Document History
May 1, 2015
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
NEN-EN-IEC 60068-2-58 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices...
October 1, 2004
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free...
NEN-EN-IEC 60068-2-58
May 1, 1999
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Provides procedures for determining tot solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD).