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NEN-EN-IEC 60317-55

Specifications for particular types of winding wires - Part 55: Solderable polyurethane enamelled round copper wire overcoated with polyamide, class 180

inactive
Organization: NEN
Publication Date: 1 May 2008
Status: inactive
Page Count: 30
ICS Code (Wires): 29.060.10
scope:

This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin. Class 180 is a thermal class that requires a minimum temperature index of 180 ºC and a heat shock temperature of at least 200 ºC. The temperature in degrees Celsius corresponding to the temperature index is not necessarily that at which it is recommended that the wire be operated and this will depend on many factors, including the type of equipment involved. The range of nominal conductor diameters covered by this standard is as follows: - Grade 1: 0,050 mm up to and including 1,600 mm; - Grade 2: 0,050 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1.

Document History

February 1, 2014
Specifications for particular types of winding wires - Part 55: Solderable polyurethane enamelled round copper wire overcoated with polyamide, Class 180
NEN-EN-IEC 60317-55 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyurethane resin, which may be...
NEN-EN-IEC 60317-55
May 1, 2008
Specifications for particular types of winding wires - Part 55: Solderable polyurethane enamelled round copper wire overcoated with polyamide, class 180
This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyurethane resin, which may...
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