NEN 11249-5-1
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 July 1996 |
| Status: | active |
| Page Count: | 48 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Gives the requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.
Document History
NEN 11249-5-1
July 1, 1996
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
Gives the requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed...