NEN-EN-IEC 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
inactive
| Organization: | NEN |
| Publication Date: | 1 February 1999 |
| Status: | inactive |
| Page Count: | 46 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
Prescribes requirements for lead and hole, solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Document History
September 1, 2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
NEN-EN-IEC 61191-3 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT...
NEN-EN-IEC 61191-3
February 1, 1999
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Prescribes requirements for lead and hole, solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of...