NEN 10249-2-19/A2
Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
inactive, Most Current
| Organization: | NEN |
| Publication Date: | 1 March 1995 |
| Status: | inactive |
| Page Count: | 1 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
NEN 10249-2-19/A2
March 1, 1995
Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
A description is not available for this item.
March 1, 1994
Base materials for printed circuits - Part 2: specifications - specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
This specification of IEC 249-2 gives requirements for properties of thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the...
March 1, 1994
Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
A description is not available for this item.