NEN-EN-IEC 60749-9
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 July 2017 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
The purpose of NEN-EN-IEC 60749-9 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test. Many available solvents that could be used are either not sufficiently active, too stringent, or even dangerous to humans when in direct contact or when fumes are inhaled.
Document History
NEN-EN-IEC 60749-9
July 1, 2017
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
The purpose of NEN-EN-IEC 60749-9 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of...
September 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Test and verify that the markings on semiconductor devices will not become illegible when subject to solvents or cleaningsolutions commonly used during the removal of solder flux residue from the...