DSF/prEN 62137-1-3
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test
inactive
| Organization: | DS |
| Status: | inactive |
| Page Count: | 20 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
This standard applies to cyclic drop tests for solder joints between terminals of surface mounting devices (hereafter called SMDs) and land patterns on printed wiring boards (PWBs).
This test is intended to evaluate the strength of the solder joints of larger sized multiterminal components and other components of handheld mobile devices against printed wiring board vibration that occurs when the mobile device drops.
Document History
March 11, 2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is...
DSF/prEN 62137-1-3
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test
This standard applies to cyclic drop tests for solder joints between terminals of surface mounting devices (hereafter called SMDs) and land patterns on printed wiring boards (PWBs).
This test is...
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test
The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).
This test is...