ECIA - EIA-540GA00
Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
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| Organization: | ECIA |
| Publication Date: | 1 January 1993 |
| Status: | inactive |
| Page Count: | 19 |
Document History
January 1, 1993
Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure (maximum length, width, and height dimensions).
b) A working voltage not exceeding _...
EIA-540GA00
January 1, 1993
Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
A description is not available for this item.