UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

ECIA - EIA-540GA00

Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment

inactive
Buy Now
Organization: ECIA
Publication Date: 1 January 1993
Status: inactive
Page Count: 19

Document History

EIA-540GA00
January 1, 1993
Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
A description is not available for this item.
January 1, 1993
Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
The Burn-In Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure (maximum length, width, and height dimensions). b) A working voltage not exceeding _...
Advertisement