ECIA - 540GA00
Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
inactive, Most Current
| Organization: | ECIA |
| Publication Date: | 1 January 1993 |
| Status: | inactive |
| Page Count: | 19 |
scope:
The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure (maximum length, width, and height dimensions).
b) A working voltage not exceeding _ volts (rms).
c) Current not exceeding _ ampere per pin.
OBJECT
The object of this Detail Specification is to provide all information required for the identification and quality assessment of the Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspection purposes.
Document History
540GA00
January 1, 1993
Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure (maximum length, width, and height dimensions).
b) A working voltage not exceeding _...
January 1, 1993
Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
A description is not available for this item.