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IPC-2221 GERMAN

Generic Standard on Printed Board Design

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Organization: IPC
Publication Date: 1 May 2003
Status: inactive
Page Count: 136
scope:

Dieses Normenwerk legt die allgemeinen Anforderungen für das Design von Leiterplatten aus organischen Materialien sowie anderen Formen der Bauteilbefestigung oder Verbindungsstrukturen fest. Die Materialien können homogen, verstärkt oder in Kombination mit anorganischen Materialien verarbeitet werden. Die Verbindungen können aus einer, zwei oder aus mehreren Lagen bestehen.

Document History

IPC-2221 GERMAN
November 1, 2012
Generic Standard on Printed Board Design
A description is not available for this item.
IPC-2221 GERMAN
May 1, 2003
Generic Standard on Printed Board Design
Dieses Normenwerk legt die allgemeinen Anforderungen für das Design von Leiterplatten aus organischen Materialien sowie anderen Formen der Bauteilbefestigung oder Verbindungsstrukturen fest. Die...

References

This document references:
JEDEC JESD 471 - Symbol and Label for Electrostatic Sensitive Devices
Published by JEDEC on February 1, 1980
Purpose It is the purpose of this Standard to provide a distinctive symbol and label to be used to identify those solid state device that require handling. The symbol or label should be used at the...
This document references:
IPC-TM-650 2.4.22 - Bow and Twist (Percentage)
Published by IPC on June 1, 1999
This test method covers three procedures used to determine the bow and twist percentage of individual rigid printed boards, rigid portions of rigid-flex printed boards, and/or multiple printed...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC-SM-840 - Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
Published by IPC on December 1, 2010
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test...
This document is referenced by:
DIN IEC/TS 62647-1 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC/TS 62647-1:2012)
Published by DIN on July 1, 2013
Dieser Teil der Reihe IEC/TS 62647 legt die Ziele und Anforderungen für die Dokumentation von Prozessen fest, die Kunden und regelsetzenden Stellen versichern, dass elektronische ADHP-Systeme, die...
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