NEN-EN-IEC 60749-32
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
active
| Organization: | NEN |
| Publication Date: | 1 August 2003 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test used a needle flame, somulating the effect of small flames which may result from fault conditions within equipment containing the device.
Document History
September 1, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
A description is not available for this item.
NEN-EN-IEC 60749-32
August 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test used a needle...