NEN-EN-IEC 60749-29
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 September 2011 |
| Status: | active |
| Page Count: | 30 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits. This test is classified as destructive. The purpose of this test is to establish a method for determining integrated circuit (IC) latchup characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up. This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established. The classification of latch-up as a function of temperature is defined in 3.1 and the failure level criteria are defined in 3.2
Document History
NEN-EN-IEC 60749-29
September 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits. This test is classified as destructive. The purpose of this test is to establish a method for...
February 1, 2004
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
Covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is to establish a method for determining integrated circuit latch-up characteristics and to...